Document Type

Article

Publication Date

2001

Department

Mathematics

Abstract

In this paper we analyse numerically thermomechanical behaviour of a sandwich-type actuator where a shape memory alloy layer is located between two oppositely doped semiconductors. The mathematical model for this analysis is based on a coupled system of partial differential equations with constitutive equations taken in the Falk form. The system is solved using an efficient differential-algebraic solver and computational results describing thermomechanical fields in such devices are presented.

Comments

This article was originally published in Journal de Physique, IV: Pr8-515-Pr8-520. © 2001 EDP Sciences

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